Precision CNC Machining for Semiconductor Equipment Components

We manufacture high-precision custom components for semiconductor manufacturing equipment — including wafer handling systems, process chambers, lithography tooling, and inspection fixtures. With ±0.01mm tolerances, 3-5 day rapid prototyping, and full MES traceability, we support your mission-critical semiconductor projects from prototype to production.

Semiconductor Equipment Component Manufacturing Capabilities

We deliver high-precision custom-machined components specifically for semiconductor manufacturing equipment — wafer handling systems, process chambers, lithography tooling, and inspection fixtures. Every project follows our full quality-control workflow, from raw material incoming inspection through final dimensional verification. We machine a wide range of materials including aluminum alloys, stainless steels, tool steels, copper alloys, and engineering plastics — detailed material capabilities are listed below. With 3 CNC machining centers, wire EDM, surface grinders, and precision inspection equipment including Nikon projectors and TESA height gauges, we ensure consistent quality across every batch. Our MES-based production tracking provides full traceability from raw material to final shipment. No minimum order quantity — we treat every part with the same rigorous quality standards.

±0.01mm Precision

Critical dimensions held to ±0.01mm tolerance, verified on Nikon profile projectors and TESA height gauges

3-5 Day Rapid Prototyping

Fast-turnaround prototype machining for semiconductor R&D and equipment maintenance

Full MES Traceability

Every part traceable to machine, operator, and inspection records via Heihu MES system

Typical Semiconductor Equipment Components We Machine

2D technical line drawing of CNC machined 440C stainless steel adapter, precision semiconductor manufacturing component, minimalist engineering sketch

Semiconductor Precision Adapter

440C stainless steel (HRC58) (equivalent to 1.4125 / SUS440C)

±0.005mm precision, Ø2mm bore (+0.012 / +0.015) tolerance

High-hardness precision adapter for semiconductor tooling

Isometric technical line drawing of semiconductor positioning drive shaft, 1.2379 D2 tool steel HRC58, precision stepped locating pin shaft for semiconductor packaging and test equipment

Semiconductor Positioning Drive Shaft

D2 tool steel (equivalent to 1.2379 / SKD11) HRC58

±0.01 mm, ENP surface treatment     Φ10 × 25 mm

High-hardness positioning drive shaft for semiconductor packaging & test equipment

2D technical line drawing of CNC machined semiconductor-grade PEEK star-shaped precision coil spacer, insulation sealing component for semiconductor equipment

Semiconductor-Grade Precision Coils

PEEK (semiconductor-grade)

±0.2mm, thin-wall precision

Insulation & sealing parts for semiconductor equipment

Semiconductor Fixture Base Plate

S235JR carbon steel (equiv. AISI 1018)

±0.01mm, ENP surface treatment

Semiconductor packaging & test equipment mounting platform

Our Semiconductor Equipment Component Manufacturing Capabilities

Aluminum Alloys

6061 · 7075 · MIC-6 · 2017A · EN AW-2017 · A6061 · A6061T6 · A7075 · AlMg2.5

Stainless Steel

SUS304 · SUS316L · 17-4PH · 440C · 303 · 1.4305 · 1.4301 · 1.4125 · 1.4528 · 3.3211 · 3.4365 · 3.3523

Tool & Die Steels

1.2379 · 1.2344 · 1.0503 · 1.173 · 1.1545 · 1.0037 · 1.164 · 1.0535 · 1.2510 · 1.2738 · D2 · H13 · O1 · P20 · 1045 · S235JR · X165CrMoV12

Copper Alloys

3.4365 · 3.3523 · 3.3211

Engineering Plastics

POM  · PEEK (semiconductor-grade, thin-wall precision) 

Additional specialty materials (titanium, Hastelloy, Invar, Kovar) also available upon request.

Our Equipment

3 CNC Centers · Wire EDM · 3 Surface Grinders · Large Surface Grinder · 3 Milling Machines · Tapping · Laser Marking

Inspection Equipment

Nikon Projector · Wanhao 2.5D CMM · TESA HITE 400 · TESA 700 · Nikon MFC 101A · Hardness Tester · Pin Gauges

Quality & Cleanliness Control for Semiconductor Equipment Components

Dimensional Precision

Critical dimensions held to ±0.01mm tolerance, verified on Nikon profile projectors and TESA height gauges

Surface Quality

Surface finishes down to Ra 0.8μm or better, with deburring and edge finishing applied to every part

Deburring & Clean Handling

Deburring to prevent particle generation, clean handling, and clean packaging for every shipment

100% Inspection

Every critical dimension verified before shipment. Actual measured values are marked directly on the 2D drawings and shipped together with every order. Formal inspection reports can also be provided upon request.

Full Traceability

Every part traceable to machine, operator, and inspection records via Heihu MES system — from raw material through final shipment

Trusted by Industry Leaders

Tier 1 supplier for Japanese semiconductor equipment manufacturer. NDAs available for confidential projects

Case Study: Precision Adapter for Semiconductor Manufacturing Tooling

Background

A semiconductor equipment manufacturer required a precision adapter component for their manufacturing tooling system — used in the assembly and positioning of critical process modules.

Challenge

  • Material: 440C stainless steel (equivalent to 1.4125 / SUS440C)

  • Hardness requirement: HRC58 (after heat treatment)

  • Critical bore tolerance: Ø2(+0.012, +0.015) — a 2mm diameter feature with a tolerance band of just 0.003mm

  • Overall dimensions: 10 × 13 × 32mm (miniature precision part)

Our Solution

  • CNC precision machining with grinding allowance

  • Heat treatment to HRC58 followed by precision grinding

  • 100% inspection on Nikon profile projector and TESA height gauge

  • Full traceability records via Heihu MES system

Result

  • All critical dimensions met drawing specifications

  • Hardness consistently achieved at HRC58

  • Parts passed 100% dimensional inspection

  • Customer placed repeat orders

Ready to Start Your Semiconductor Equipment Component Project?

Send us your 2D/3D drawings or share your requirements. We’ll provide a competitive quote within 24 hours — no MOQ, full MES traceability, and ±0.01mm precision guaranteed for wafer handling components, process chamber parts, and semiconductor inspection fixtures.

Scroll to Top